PDF | On Aug 1, 2016, Jinglong Sun and others published Edge chipping of silicon wafers in rotating grinding | Find, read and cite all the research you need on
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This article explains the process of optical fiber polishing, which is crucial for preparing high-quality fiber endfaces for applications like fiber connectors and
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Rotating grinding is the most commonly used technique in silicon wafer thinning, while it will induce edge chipping as wafer thickness decrease. This will lead to wafer breakage, and thus resulting in cost
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The causes and improving methods of chipping were studied from CMP (Chemical Mechanical Polishing) and Trim1 (First Trimming process before bonding) perspectives. Chipping is
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The polishing fixture is easy to disassemble, enabling quick switching between grinding and polishing processes, making it suitable for polishing in
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Traditionally, these edges have been diced, leaving a chipped edge. However, by utilizing Valley''s new technology, which achieves an optical quality edge surface finish with chipping of less than 1 micron,
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The formation mechanism of edge chipping during sawing process was analyzed in detail. Effects of ultrasonic assisted vibration on the edge chipping phenomenon during sawing were
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When grinding perpendicular to the fiber orientation, edge chipping represents fiber pull-out, lateral cracking, matrix chipping, while grinding along with the fiber orientation, edge chipping is
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To restrain edge chipping and elucidate its mechanism during machining, the initiation of edge chipping was investigated in this study from the propagation properties of stress waves in the
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The study correlates edge chipping with the crystallographic orientation and thickness of a silicon wafer, as well as grinding process conditions, such as wheel grit size, grinding mode and feed
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At all times the work piece is held in an appropriate and often custom fabricated polishing jig. The work piece is cleaned and inspected by the polishing operator at each step before going on
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The paper presents a process to restrain edge chipping in grinding segmented mirrors using powder-added filler based on the mechanism of stress wave propagation.
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Corning OEM offers a broad range of Fiber Array Units (FAUs) for long-haul, metro networks and data center applications. With customizable V-groove chips and covers, and Corning''s
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FLex is capable of polishing a variety of waveguide components such as PLCs, PIC optical chips and fiber arrays. It integrates universal carriers that can accommodate components of various
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This paper describes the results of investigation on the rotary ultrasonic machining (RUM) of the float glass with the primary objective of analyzing and remedying the edge chipping defects.
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This paper presents production conditions of classical optical grinding and polishing method, when producing sharp inner edges on fused quartz glass capillary or
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Edge chipping after wafer grinding is a very common and challenging problem. It can lead to decreased wafer strength, making it more
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BFJIG-4PFA-SQFT FA fiber array polishing fixture by the Shenzhen Neofibo Technology Limited independent research and development design, dedicated to FA fiber array of a fixture. This product
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Optical waveguides begin and end at these faces. Traditionally, these edges have been diced, leaving a chipped edge. However, by utilizing Valley''s new technology, which achieves an optical quality edge
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Fiber arrays are 1D or 2D arrays of optical fibers, used for coupling to photonic circuits, telecom signals, and laser beam combining.
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We can attach single fibers or fiber arrays to your PIC in an edge-coupling or (quasi-planar) grating coupling configuration, using active or passive alignment. Our in-house assembly tools can achieve
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V-grooves monolithically integrated with PICs permit low loss edge coupling with passive alignment to single fibers or fiber arrays. Hybrid integration strategies
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Fiber Protrusion also has a limit--50nm of protrusion being acceptable--Both Undercut and Protrusion, are a result of the polishing process. If excessive protrusion is present, fiber chipping and/or cracking
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In conclusion, it has been confirmed that the C-cut, trimmed, and thinned edge shapes are effective in preventing edge chipping. However,
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Fiber Optic Connectors: Meeting Polishing Demands To ensure fast, error-free data transmission, connectors must conform to acceptance criteria related to backreflection and insertion loss, as well
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Learn how to effectively reduce edge chipping after wafer thinning in semiconductor manufacturing. This guide explains the main causes of wafer edge
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However, compared to ductile materials, achieving high-efficiency, low-damage grinding for HBMs remains a significant challenge. The inherent high hardness and low fracture toughness of
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The edge chipping in the grinding perpendicular to the fiber orientation is larger than that in the grinding along with the fiber orientation. It decreases with increasing grinding speed.
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