We report on progress and results towards the development of a high speed, low cost, low energy (<4pJ/bit) chip scale optical module for co-packaging on a first-level organic substrate for HPC and Data Center applications. Recently, the PMD working group of International Photonics & Electronics Committee (IPEC) Technical Committee initiated the 1. 6T optical module standards project. Jointly led by Meituan, China Telecom, and Huawei, the standards project has also gained the support of IPEC members such as Kuaishou. MPS provides compact and comprehensive solutions that feature high efficiency and low ripple characteristics to meet the design requirements of high-speed optical module power supply solutions. When thousands of GPUs work together, data must move across nodes, racks, and campuses with very low latency and very high stability. As a result, networks have become a core bottleneck. Applications in automotive, home & SOHO, and industrial benefit from KD's future-proven system solutions for connectivity over fiber optics.
